The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Nov. 18, 2011
Jeong-hoon Ahn, Yongin-si, KR;
Hyun-min Choi, Anyang-si, KR;
Oluwafemi O. Ogunsola, South Hopewell Junction, NY (US);
Jeong-Hoon Ahn, Yongin-si, KR;
Hyun-Min Choi, Anyang-si, KR;
Oluwafemi O. Ogunsola, South Hopewell Junction, NY (US);
Samsung Electronics Co., Ltd., , KR;
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods of fabricating integrated circuit devices utilize fuse elements to support sequential testing of vertically-integrated test elements during fabrication. These methods include forming a first test element, a first fuse and a first test pad electrically connected by the first fuse to the first test element, on a substrate. The first test element is tested by passing a first current between the first test element and first test pad and through the first fuse. The first fuse is then 'cut' by increasing an impedance of the first fuse, which may include breaking the first fuse to create an electrical 'open' (infinite impedance) or greatly increasing a resistance of the first fuse (e.g., by narrowing the fuse through electromigration). A second test element and a second test pad, which is electrically connected to the second test element and the first test pad, are then formed on the substrate.