The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Jul. 11, 2014
Applicant:

Inoso, Llc, Austin, TX (US);

Inventors:

Ziep Tran, Austin, TX (US);

Kiyoshi Mori, Missouri City, TX (US);

Giang Trung Dao, Milpitas, CA (US);

Michael Edward Ramon, Austin, TX (US);

Assignee:

INOSO, LLC, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 27/02 (2006.01); H01L 21/8238 (2006.01); H01L 21/82 (2006.01); H01L 21/84 (2006.01); H01L 21/86 (2006.01); H01L 29/20 (2006.01); H01L 29/16 (2006.01); H01L 27/092 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0211 (2013.01); H01L 21/8213 (2013.01); H01L 21/8238 (2013.01); H01L 21/845 (2013.01); H01L 21/86 (2013.01); H01L 27/092 (2013.01); H01L 27/1211 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/2006 (2013.01); H01L 29/45 (2013.01);
Abstract

A method of forming a stacked low temperature transistor and related devices. At least some of the illustrative embodiments are methods comprising forming at least one integrated circuit device on a front surface of a bulk semiconductor substrate, and depositing an inter-layer dielectric on the at least one integrated circuit device. A semiconductor layer may then be deposited on the inter-layer dielectric. In some embodiments, a transistor is formed within the semiconductor layer. In some examples, the transistor includes a gate structure formed over the semiconductor layer as well as source/drain regions formed within the semiconductor layer disposed adjacent to and on either side of the gate structure. A metal layer may then be deposited over the transistor, after which an annealing process is performed to induce a reaction between the source/drain regions and the metal layer.


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