The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Apr. 18, 2011
Applicants:

Chih-hua Hsu, New Taipei, TW;

Jung-shiung Liau, New Taipei, TW;

Chin-hsien Chen, New Taipei, TW;

Gustavo Salazar, New Taipei, TW;

Inventors:

Chih-Hua Hsu, New Taipei, TW;

Jung-Shiung Liau, New Taipei, TW;

Chin-Hsien Chen, New Taipei, TW;

Gustavo Salazar, New Taipei, TW;

Assignee:

Wistron Corporation, Hsichih, New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G09F 13/04 (2006.01); G02F 1/1335 (2006.01); H05K 1/18 (2006.01); G02F 1/1333 (2006.01); G09F 13/22 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
G09F 13/04 (2013.01); G02F 1/133603 (2013.01); H05K 1/189 (2013.01); G02F 2001/133342 (2013.01); G02F 2001/133628 (2013.01); G09F 2013/222 (2013.01); H05K 1/0203 (2013.01); H05K 3/0061 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A backlight module includes a flexible circuit board. The flexible circuit board includes a conductive layer and an insulating layer covering the conductive layer. The backlight module further includes a plurality of light emitting diodes respectively disposed on two sides of the flexible circuit board and electrically connected to the conductive layer of the flexible circuit board for emitting light towards the two sides of the flexible circuit board.


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