The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Sep. 11, 2009
Kazumasa Seki, Kusatsu, JP;
Akihiko Hatamura, Uji, JP;
Hitoshi Yoshida, Otsu, JP;
Toshio Yamashita, Moriyama, JP;
Yasuhiro Miura, Kyoto, JP;
Kazumasa Seki, Kusatsu, JP;
Akihiko Hatamura, Uji, JP;
Hitoshi Yoshida, Otsu, JP;
Toshio Yamashita, Moriyama, JP;
Yasuhiro Miura, Kyoto, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: where 300 μm≦W; H≧W/3.75 where 200 μm≦W<300 μm; H≧W/4 where 100 μm≦W<200 μm; and H≧W/10 where W<100 μm.