The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Mar. 04, 2013
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Tsukuru Mizuguchi, Otsu, JP;

Satoshi Matsuba, Nagoya, JP;

Kazutaka Kusano, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/027 (2006.01); G03F 7/40 (2006.01); H03B 13/00 (2006.01); H05K 1/09 (2006.01); C09D 5/24 (2006.01); H01B 1/22 (2006.01); G03F 7/004 (2006.01); G03F 7/038 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); G03F 7/0047 (2013.01); G03F 7/027 (2013.01); G03F 7/038 (2013.01); G03F 7/40 (2013.01); H01B 1/22 (2013.01); H05K 1/028 (2013.01); H05K 1/0296 (2013.01); H05K 1/092 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.


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