The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2015

Filed:

Dec. 14, 2012
Applicant:

Asahi Glass Company, Limited, Chiyoda-ku, JP;

Inventors:

Toshihiro Takeuchi, Chiyoda-ku, JP;

Satoshi Fujimine, Chiyoda-ku, JP;

Kazuo Yamada, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 8/24 (2006.01); C03C 3/14 (2006.01); C03C 17/04 (2006.01); H05B 33/04 (2006.01); H05B 33/10 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
C03C 8/24 (2013.01); C03C 3/14 (2013.01); C03C 17/04 (2013.01); H05B 33/04 (2013.01); H05B 33/10 (2013.01); H01L 51/5246 (2013.01);
Abstract

A sealing material paste and a process for producing an electronic device are provided, which realize suppressing with good reproducibility generation of bubbles in a sealing layer when a rapid heating-rapid cooling process with a temperature-rising speed of at least 100° C./min is applied to seal two glass substrates together. The sealing material paste, wherein the amount of water is at most 2 volume %, is applied on a sealing region of a glass substrate, and such a coating filmis fired to form a sealing material layer. The glass substrateis laminated with another glass substrate via a sealing material layer, and they are heated with a temperature-rising speed of at least 100° C./min to be sealed together.


Find Patent Forward Citations

Loading…