The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Jan. 29, 2014
Canon Kabushiki Kaisha, Tokyo, JP;
Takayuki Ono, Kawasaki, JP;
Masao Furukawa, Yokohama, JP;
Masashi Ishikawa, Chofu, JP;
Jun Hinami, Kawasaki, JP;
Takeshi Shibata, Yokohama, JP;
Ryo Shimamura, Yokohama, JP;
Takanori Enomoto, Tokyo, JP;
Shimpei Otaka, Kawasaki, JP;
Tomohiro Takahashi, Yokohama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.