The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Jul. 27, 2010
Hitoshi Shimadu, Obu, JP;
Kazunori Kondou, Obu, JP;
Takehiko Sawada, Obu, JP;
Takahiro Hayakawa, Obu, JP;
Tomoaki Asai, Obu, JP;
Ryou Yamauchi, Obu, JP;
Hitoshi Shimadu, Obu, JP;
Kazunori Kondou, Obu, JP;
Takehiko Sawada, Obu, JP;
Takahiro Hayakawa, Obu, JP;
Tomoaki Asai, Obu, JP;
Ryou Yamauchi, Obu, JP;
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi-ken, JP;
Abstract
Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts () surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.