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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9084368 B1

PDFFull Text
Date of Patent:
Jul. 14, 2015

Filed:

Apr. 03, 2012

Single fpc board for connecting multiple modules and touch sensitive display module using the same

Applicants:

Jiun-jie Tsai, Hsinchu, TW;

Ching-chun Lin, New Taipei, TW;

Tsen-wei Chang, Taichung, TW;

Yu-tsung LU, Hsinchu, TW;

Tzu-jen Lo, Hsinchu, TW;

Hao-jan Huang, Hsinchu, TW;

Wing-kai Tang, Hsinchu, TW;

Inventors:

Jiun-Jie Tsai, Hsinchu, TW;

Ching-Chun Lin, New Taipei, TW;

Tsen-Wei Chang, Taichung, TW;

Yu-Tsung Lu, Hsinchu, TW;

Tzu-Jen Lo, Hsinchu, TW;

Hao-Jan Huang, Hsinchu, TW;

Wing-Kai Tang, Hsinchu, TW;

Assignee:

NOVATEK MICROELECTRONICS CORP., Hsinchu, TW;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Lun-Yi Lao

Assistant Examiner:

Elliott Deaderick

Int. Cl.
CPC ...
G06F 3/041 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); G06F 1/16 (2006.01); G06F 1/18 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); G06F 1/1626 (2013.01); G06F 1/184 (2013.01); G06F 1/185 (2013.01); G06F 3/041 (2013.01); G06F 3/0412 (2013.01); H05K 1/028 (2013.01); G06F 2203/04102 (2013.01); H05K 1/147 (2013.01); H05K 2201/052 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.

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