The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Jan. 11, 2013
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Che-chang Hu, Shenzhen, CN;

Kuang-Yao Chang, Shenzhen, CN;

Qian Cao, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G02F 1/1335 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); G02F 1/1336 (2013.01); H05K 1/056 (2013.01); G02F 2001/133612 (2013.01); G02F 2001/133628 (2013.01); H05K 2201/0761 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/302 (2013.01);
Abstract

The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.


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