The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Mar. 28, 2013
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Hidekazu Kobayashi, Nagano-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 1/04 (2006.01); H04N 1/00 (2006.01); B29C 39/02 (2006.01); B29C 45/26 (2006.01); H04N 1/031 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
H04N 1/00557 (2013.01); B29C 39/02 (2013.01); B29C 45/2628 (2013.01); H04N 1/0318 (2013.01); B29L 2011/0075 (2013.01); H04N 2201/02487 (2013.01); H04N 2201/03125 (2013.01);
Abstract

A light guide inserted into an inclined groove is disposed so as to partially overlap with a lens unit that is fitted into a concave groove disposed parallel to the inclined groove when seen in a plan view, to regulate the separation of the lens unit from the concave groove and hold the lens unit in an insertion state by the light guide. Therefore, a fixing unit such as an adhesive agent is not required in fixedly disposing the light guide and the lens unit at a predetermined position of a frame, and a CIS module is assembled without using an adhesive agent, thereby allowing the CIS module that is easily disassembled when being discarded and that improves recycling efficiency to be provided.


Find Patent Forward Citations

Loading…