The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Nov. 03, 2010
Applicants:

Dennis Dean Clark, Lewistown, PA (US);

Barry Scheirer, McAlisterville, PA (US);

Ryan Manning, Lewistown, PA (US);

Inventors:

Dennis Dean Clark, Lewistown, PA (US);

Barry Scheirer, McAlisterville, PA (US);

Ryan Manning, Lewistown, PA (US);

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01); H01L 41/047 (2006.01); A61N 7/02 (2006.01); B06B 1/06 (2006.01); G10K 11/32 (2006.01); H01L 41/29 (2013.01); A61N 7/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); A61N 7/02 (2013.01); B06B 1/0637 (2013.01); G10K 11/32 (2013.01); H01L 41/29 (2013.01); A61N 2007/0065 (2013.01); A61N 2007/0078 (2013.01); A61N 2007/0095 (2013.01); H05K 3/325 (2013.01);
Abstract

A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite concave front and convex back surfaces, and a plurality of acoustic transmission areas, a plurality of electrodes located on the convex back surface of the curved piezoelectric array for applying electrical transmit signals to the acoustic transmission areas, and a printed circuit board spaced apart from and in opposition to the back surface of the curved piezoelectric array which couples electrical signals to the acoustic transmission areas, the printed circuit board comprising a plurality of metal contacts which are compliant in the presence of thermal expansion and contraction and which span the space between the printed circuit board and the curved piezoelectric array and are electrically coupled to electrodes of the acoustic transmission areas of the curved piezoelectric array.


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