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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9082844 B1

PDFFull Text
Date of Patent:
Jul. 14, 2015

Filed:

Nov. 12, 2013

Methods of transferring semiconductor elements and manufacturing semiconductor devices

Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Eun-hyoung Cho, Hwaseong-si, KR;

Jun-Hee Choi, Seongnam-si, KR;

Jin-seung Sohn, Seoul, KR;

Chang-youl Moon, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Charles Garber

Assistant Examiner:

Evren Seven

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/78 (2006.01); H01L 33/00 (2010.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/82 (2006.01); H01L 33/02 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 21/7806 (2013.01); H01L 21/02343 (2013.01); H01L 21/28 (2013.01); H01L 21/82 (2013.01); H01L 33/0079 (2013.01); H01L 33/02 (2013.01); H01L 33/32 (2013.01);
Abstract

The present disclosure relates to a method of transferring semiconductor elements from a non-flexible substrate to a flexible substrate. The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements grown or formed on a non-flexible substrate may be effectively transferred to a resin layer while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements.

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