The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Sep. 07, 2011
Applicants:

Marcus Ahles, Pfullingen, DE;

Jochen Reinmuth, Reutlingen, DE;

Hubert Benzel, Pliezhausen, DE;

Simon Armbruster, Wannweil, DE;

Inventors:

Marcus Ahles, Pfullingen, DE;

Jochen Reinmuth, Reutlingen, DE;

Hubert Benzel, Pliezhausen, DE;

Simon Armbruster, Wannweil, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); B81C 1/00 (2006.01); H01L 21/764 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); B81C 1/00095 (2013.01); H01L 21/764 (2013.01); H01L 23/481 (2013.01); B81B 2201/0264 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/131 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap.


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