The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Oct. 02, 2014
Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventor:

Jun Ki Kim, Seoul, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 21/337 (2006.01); H01L 49/02 (2006.01); H01L 27/108 (2006.01); H01L 21/768 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 21/30625 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/76885 (2013.01); H01L 21/76895 (2013.01); H01L 27/10844 (2013.01); H01L 27/10852 (2013.01); H01L 27/10894 (2013.01); H01L 28/91 (2013.01);
Abstract

Methods of fabricating a semiconductor device are provided. The method includes forming a first mold layer on a in a cell region and a peripheral region, forming first storage nodes penetrating the first mold layer in the cell region and a first contact penetrating the first mold layer in the peripheral region, forming a second mold layer on the first mold layer, forming second storage nodes that penetrate the second mold layer to be connected to respective ones of the first storage nodes, removing the second mold layer in the cell and peripheral regions and the first mold layer in the cell region to leave the first mold layer in the peripheral region, and forming a second contact that penetrates a first interlayer insulation layer to be connected to the first contact. Related devices are also provided.


Find Patent Forward Citations

Loading…