The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Dec. 11, 2012
Huawei Device Co., Ltd., Shenzhen, CN;
Xiong Yang, Shanghai, CN;
HUAWEI DEVICE CO., LTD., Shenzhen, CN;
Abstract
Embodiments of the present invention disclose a method for encapsulating a component with plastic and its encapsulation structure, which belong to the plastic encapsulation technology field. The method includes: processing, by using the surface mounting technology, a first surface of a part to be encapsulated with plastic and/or performing die bonding on the first surface; encapsulating, with plastic, the first surface of the part to be encapsulated with plastic a second surface of the part to be encapsulated with plastic the first surface and/or performing die bonding in the second face; and encapsulating, with plastic, the second surface of the part to be encapsulated with plastic. This encapsulation structure includes a substrate, where components are fixed on an upper surface and a lower surface of the substrate, and the components on the upper surface and lower surface are all encapsulated with plastic in seal.