The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Nov. 15, 2012
Infineon Technologies Ag, Neubiberg, DE;
Carlo Baterna Marbella, Singapore, SG;
Ganesh Vetrivel Periasamy, Singapore, SG;
Woon Yik Yong, Singapore, SG;
Kok Kiat Koo, Singapore, SG;
Christian Arndt, Munich, DE;
Edward Myers, Munich, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on the chip carrier and an encapsulant encapsulating the chip and the chip carrier. The semiconductor package further including a pin protruding from the encapsulant and a fail open mechanism disposed on the encapsulant and connected to the pin, wherein the fail open mechanism is configured to be disconnected from the pin if a temperature exceeds a pre-determined temperature.