The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Aug. 16, 2012
Applicants:

Masahiro Kimura, Kyoto, JP;

Tomonori Umezaki, Yamaguchi, JP;

Akiou Kikuchi, Yamaguchi, JP;

Inventors:

Masahiro Kimura, Kyoto, JP;

Tomonori Umezaki, Yamaguchi, JP;

Akiou Kikuchi, Yamaguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/3213 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H01L 27/115 (2006.01); H01L 21/67 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32135 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/6719 (2013.01); H01L 27/11578 (2013.01); H01L 27/11582 (2013.01); H01L 29/66833 (2013.01); H01L 29/7926 (2013.01); H01L 21/30604 (2013.01); H01L 21/31138 (2013.01);
Abstract

A pattern forming method is provided for forming a pattern of a multilayer film including insulative films and electrically conductive films stacked together and having a hole formed therein on a substrate with the electrically conductive film being selectively accurately indented from an inner peripheral surface of the hole. The pattern forming method includes the steps of: alternately stacking at least two insulative films and at least two polysilicon films on a substrate to form a multilayer film including the at least two insulative films and the at least two polysilicon films; forming a hole extending through the at least two insulative films and the at least two polysilicon films in the multilayer film; and selectively etching the polysilicon films from a side wall of the hole through isotropic etching by feeding into the hole an etching gas prepared by diluting fluorine-containing halogen gas with an inert gas.


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