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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9082649 B1

PDFFull Text
Date of Patent:
Jul. 14, 2015

Filed:

Nov. 25, 2014

Passivation process to prevent tiw corrosion

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Richard Allen Faust, Dallas, TX (US);

Joseph Nguyen, Garland, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Jacqueline J. Garner

Frank D. Cimino

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/76843 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 24/13 (2013.01); H01L 23/49838 (2013.01); H01L 24/20 (2013.01); H01L 2224/11005 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01);
Abstract

Disclosed is an under bump metallization structure including a plurality of metal or metal alloy layers formed on chip bond pads with improved reliability due to a sacrificial metal oxide and the methods of making the under bump metallization structures. A barrier layer is formed over a bond pad. A seed layer is formed over the barrier layer. A bump resist pattern is formed exposing an area over the bond pad and a metal layer is electroplated on the seed layer.

Find Patent Forward Citations

Faust, Richard. (2015). Passivation process to prevent tiw corrosion (U.S. Patent No. 9082649). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9082649

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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