The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Nov. 25, 2014
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Richard Allen Faust, Dallas, TX (US);
Joseph Nguyen, Garland, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/76843 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 24/13 (2013.01); H01L 23/49838 (2013.01); H01L 24/20 (2013.01); H01L 2224/11005 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01);
Abstract
Disclosed is an under bump metallization structure including a plurality of metal or metal alloy layers formed on chip bond pads with improved reliability due to a sacrificial metal oxide and the methods of making the under bump metallization structures. A barrier layer is formed over a bond pad. A seed layer is formed over the barrier layer. A bump resist pattern is formed exposing an area over the bond pad and a metal layer is electroplated on the seed layer.