The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Oct. 13, 2011
Applicant:
Douglas M. Grant, Gorebridge, GB;
Inventor:
Douglas M. Grant, Gorebridge, GB;
Assignee:
XILINX, INC., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 29/40 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/40 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/433 (2013.01); H01L 23/34 (2013.01); H01L 23/552 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4037 (2013.01); H01L 2023/4043 (2013.01); H01L 2023/4068 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract
An integrated circuit structure can include a first die including a first surface and a second surface and a second die including a first surface and a second surface. The first surface of the first die can be coupled to the second surface of the second die. The integrated circuit structure also can include a heat sink coupled to the first surface of the first die and the first surface of the second die.