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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9082469 B1

PDFFull Text
Date of Patent:
Jul. 14, 2015

Filed:

Sep. 14, 2012

Semiconductor memory device and writing method of id codes and upper addresses

Applicants:

Akira Ogawa, Tokyo, JP;

Yoshichika Nakaya, Tokyo, JP;

Inventors:

Akira Ogawa, Tokyo, JP;

Yoshichika Nakaya, Tokyo, JP;

Assignee:

Powerchip Technology Corp., Hsin-chu, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Thao H Bui

Int. Cl.
CPC ...
G11C 17/16 (2006.01); G11C 8/12 (2006.01); G11C 7/16 (2006.01); G11C 7/20 (2006.01); G11C 29/44 (2006.01);
U.S. Cl.
CPC ...
G11C 8/12 (2013.01); G11C 7/16 (2013.01); G11C 7/20 (2013.01); G11C 2029/4402 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3011 (2013.01);
Abstract

A semiconductor chip Dof a flash memory which is stacked together with other semiconductor chips D˜DN to form a multi-chip package (MCP), including a memory cell arrayof the flash memory for storing an ID code and an upper address, wherein the ID code is written into the a fuse data regionF of the memory cell arraybefore the assembly process. According to the invention, ID codes and upper addresses can be assigned and written to each of the semiconductor chips of a multi-chip package easily without increasing the size of the semiconductor chips in comparison with the prior art.

Find Patent Forward Citations

Ogawa, Akira. (2015). Semiconductor memory device and writing method of id codes and upper addresses (U.S. Patent No. 9082469). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9082469

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