The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

Mar. 14, 2008
Applicants:

Grigoriy Basin, San Francisco, CA (US);

Robert Scott West, Morgan Hill, CA (US);

Paul S. Martin, Pleasanton, CA (US);

Gerard Harbers, Sunnyvale, CA (US);

Willem H. Smits, Veldhoven, NL;

Robert F. M. Hendriks, Overlangel, NL;

Frans H. Konijn, Huizen, NL;

Inventors:

Grigoriy Basin, San Francisco, CA (US);

Robert Scott West, Morgan Hill, CA (US);

Paul S. Martin, Pleasanton, CA (US);

Gerard Harbers, Sunnyvale, CA (US);

Willem H. Smits, Veldhoven, NL;

Robert F. M. Hendriks, Overlangel, NL;

Frans H. Konijn, Huizen, NL;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); G02B 19/00 (2006.01); H01L 23/00 (2006.01); H01L 33/54 (2010.01); H05K 3/28 (2006.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
G02B 19/0066 (2013.01); G02B 19/0028 (2013.01); G02B 19/0071 (2013.01); H01L 24/97 (2013.01); H01L 33/54 (2013.01); H05K 3/284 (2013.01); H01L 33/46 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19107 (2013.01); H05K 2201/10106 (2013.01);
Abstract

One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).


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