The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

May. 14, 2012
Applicants:

Marie-francoise Gayral Chirac, Viviers-les-Montagnes, FR;

Sebastien Kerverdo, Vincennes, FR;

Jerome Guilbot, Castres, FR;

Herve Rolland, Castres, FR;

Inventors:

Marie-Francoise Gayral Chirac, Viviers-les-Montagnes, FR;

Sebastien Kerverdo, Vincennes, FR;

Jerome Guilbot, Castres, FR;

Herve Rolland, Castres, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 1/722 (2006.01); C11D 1/825 (2006.01); C11D 3/22 (2006.01); B08B 3/04 (2006.01); C11D 3/00 (2006.01); C11D 3/04 (2006.01); C11D 3/20 (2006.01); C11D 1/66 (2006.01); C11D 1/72 (2006.01);
U.S. Cl.
CPC ...
C11D 3/221 (2013.01); C11D 1/825 (2013.01); C11D 1/8255 (2013.01); C11D 3/0026 (2013.01); C11D 3/042 (2013.01); C11D 3/2075 (2013.01); C11D 1/662 (2013.01); C11D 1/72 (2013.01); C11D 1/722 (2013.01);
Abstract

A composition (C) of formula (I): R—O-(G)-H (I). G is a reducing sugar, Ris a heptyl radical, p is a decimal number, and 1<p≦5. Composition (C) is a mixture of compounds of five formulae: R—O-(G)-H (I), R—O-(G)-H (I), R—O-(G)-H (I), R—O-(G)-H (I), and R—O-(G)-H (I). The sum of their molar proportions a, a, a, aand aequals 1, and p=a+2a+3a+4a+5a. Composition (C) is a solubilising agent in an acidic aqueous composition for non-ionic surfactant(s) according to: R—(O—CH(R')—CH)—(O—CH—CH)—O—H (II). R is a C8-C14 aliphatic radical, R′ is CHor CHCH, 0≦n≦15, 0≦m≦15, and (n+m)>0. Also, compositions (C) having 0.2-40% mass of composition(s) (C) and 0.2-80% mass non-ionic surfactant(s) of formula (II), which may be used to clean hard surfaces.


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