The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Sep. 18, 2013
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); C09K 11/77 (2006.01); C09J 183/04 (2006.01); C09J 183/08 (2006.01); H01L 33/50 (2010.01); C09K 11/08 (2006.01); C09J 7/02 (2006.01); C08G 77/26 (2006.01);
U.S. Cl.
CPC ...
C09K 11/7721 (2013.01); C09J 7/026 (2013.01); C09J 7/0207 (2013.01); C09J 183/04 (2013.01); C09J 183/08 (2013.01); C09K 11/08 (2013.01); H01L 33/50 (2013.01); H01L 33/505 (2013.01); C08G 77/26 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2483/00 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0041 (2013.01); Y10T 428/2852 (2015.01);
Abstract
A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more.