The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2015

Filed:

May. 16, 2012
Applicants:

Hodaka Miura, Kobe, JP;

Akio Sugimoto, Kobe, JP;

Inventors:

Hodaka Miura, Kobe, JP;

Akio Sugimoto, Kobe, JP;

Assignee:

Kobe Steel, Ltd., Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 37/12 (2006.01); B32B 15/04 (2006.01); B32B 5/18 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 37/06 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 5/18 (2013.01); B32B 7/12 (2013.01); B32B 15/046 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 37/06 (2013.01); B32B 2250/40 (2013.01); B32B 2266/025 (2013.01); B32B 2305/022 (2013.01); B32B 2307/308 (2013.01); B32B 2309/105 (2013.01); B32B 2311/00 (2013.01); B32B 2605/08 (2013.01);
Abstract

Disclosed are: a composite formed article which is usable even in a high-temperature environment and less suffers delamination between a foamed resin sheet and a metal sheet; and a formed article precursor (laminated sheet) which enables the manufacture of the composite formed article. The laminated sheet includes a foamable resin sheet containing a resin and a foaming agent; and, provided on both sides of the resin sheet, a pair of metal sheets each through the medium of an adhesive. The resin has a melting point of 145° C. or higher, and the adhesive has a melting point substantially equal to or higher than the melting point of the resin.


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