The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Dec. 08, 2011
Tokunobu Nohara, Yokkaichi, JP;
Mitsuru Shinohara, Yokkaichi, JP;
Takuya Chiba, Yokkaichi, JP;
Masaharu Oikawa, Yokkaichi, JP;
Tokunobu Nohara, Yokkaichi, JP;
Mitsuru Shinohara, Yokkaichi, JP;
Takuya Chiba, Yokkaichi, JP;
Masaharu Oikawa, Yokkaichi, JP;
JSP CORPORATION, Tokyo, JP;
Abstract
A process produces a polyolefin-based resin expanded beads molded article that is excellent in bending deflection characteristics, high in porosity, low in bulk density and light in weight, and has interconnected void spaces. The process comprises filling, in a mold cavity, multi-layered polyolefin-based resin expanded beads each of which has a cylindrical, polyolefin-based resin expanded core layer and a polyolefin-based resin outer layer covering the expanded core layer and which satisfy specific requirements, introducing steam in the mold cavity to heat the multi-layered expanded beads filled in the mold cavity to fuse bond and mold the multi-layered expanded beads in the mold cavity.