The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Sep. 12, 2011
Applicants:
Takehiko Sumi, Ebina, JP;
Tadatoshi Tanji, Fujisawa, JP;
Masaaki Onodera, Yamato, JP;
Tatsuya Fukuda, Tokyo, JP;
Sho Nakajima, Yamato, JP;
Inventors:
Takehiko Sumi, Ebina, JP;
Tadatoshi Tanji, Fujisawa, JP;
Masaaki Onodera, Yamato, JP;
Tatsuya Fukuda, Tokyo, JP;
Sho Nakajima, Yamato, JP;
Assignee:
KYORAKU CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/08 (2006.01); B29C 51/26 (2006.01); B29C 51/02 (2006.01); B29C 47/36 (2006.01); B29C 47/00 (2006.01); B29C 47/34 (2006.01); B29C 51/10 (2006.01); B29K 23/00 (2006.01); B29L 23/00 (2006.01); B29L 31/30 (2006.01); B29K 503/04 (2006.01); B29K 96/04 (2006.01); B29C 47/08 (2006.01); B29C 47/16 (2006.01); B29C 47/54 (2006.01); B29C 49/00 (2006.01); B29K 105/04 (2006.01); B29C 51/30 (2006.01); B29C 49/04 (2006.01); B29C 49/42 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 51/261 (2013.01); B29C 47/0021 (2013.01); B29C 47/0054 (2013.01); B29C 47/366 (2013.01); B29C 51/02 (2013.01); B29C 51/267 (2013.01); B29C 47/0004 (2013.01); B29C 47/004 (2013.01); B29C 47/0019 (2013.01); B29C 47/084 (2013.01); B29C 47/165 (2013.01); B29C 47/34 (2013.01); B29C 47/54 (2013.01); B29C 49/0005 (2013.01); B29C 49/041 (2013.01); B29C 51/10 (2013.01); B29C 51/303 (2013.01); B29C 2049/047 (2013.01); B29C 2049/4294 (2013.01); B29C 2791/001 (2013.01); B29C 2791/006 (2013.01); B29C 2947/926 (2013.01); B29C 2947/9259 (2013.01); B29C 2947/92647 (2013.01); B29C 2947/92857 (2013.01); B29C 2947/92904 (2013.01); B29C 2947/92923 (2013.01); B29C 2947/92933 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2096/04 (2013.01); B29K 2101/12 (2013.01); B29K 2105/04 (2013.01); B29K 2223/06 (2013.01); B29K 2223/12 (2013.01); B29K 2503/04 (2013.01); B29L 2023/003 (2013.01); B29L 2023/004 (2013.01); B29L 2023/22 (2013.01); B29L 2031/3032 (2013.01);
Abstract
The present invention provides a duct molding method by which it is possible to improve the adhesion of a sheet. In the duct molding method of the present invention, a molten thermoplastic resin sheet is positioned between molds. Subsequently, the thermoplastic resin sheet (P) is absorbed onto cavity surfaces of the molds and the molds are closed. Thereby, a duct is molded.