The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Apr. 27, 2010
Takashi Shoji, Kawasaki, JP;
Takekazu Sakai, Yokohama, JP;
Takashi Shoji, Kawasaki, JP;
Takekazu Sakai, Yokohama, JP;
SHOW A DENKO K.K., Tokyo, JP;
Abstract
The present invention has been made in consideration of the above-described situation, and provides a method of producing a circuit board that can bond a component to be mounted without slanting the component, and simplify the steps. The method of producing a circuit board includes forming a first adhesive layer by applying a first adhesiveness-imparting compound on the surface of terminal portions of a circuit board; attaching a core body on the first adhesive layer of the terminal portions; forming a second adhesive layer by applying a second adhesiveness-imparting compound on the surface of the core body; attaching first solder particles on the second adhesive layer of the surface of the core body; and forming a solder layer on the surface of the core body by melting the first solder particles.