The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Aug. 31, 2011
Applicants:

Paul Kevin Hall, Lexington, KY (US);

Keith Bryan Hardin, Lexington, KY (US);

Zachary Charles Nathan Kratzer, Lexington, KY (US);

Qing Zhang, Lexington, KY (US);

Inventors:

Paul Kevin Hall, Lexington, KY (US);

Keith Bryan Hardin, Lexington, KY (US);

Zachary Charles Nathan Kratzer, Lexington, KY (US);

Qing Zhang, Lexington, KY (US);

Assignee:

Lexmark International, Inc., Lexington, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 3/00 (2006.01); H01C 17/06 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); C04B 35/622 (2006.01); H05K 1/02 (2006.01); B28B 7/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01); H05K 1/0231 (2013.01); H05K 1/0233 (2013.01); H05K 1/0248 (2013.01); H05K 1/0251 (2013.01); H05K 3/4046 (2013.01); H05K 2201/09645 (2013.01); B28B 7/16 (2013.01); C04B 35/622 (2013.01);
Abstract

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.


Find Patent Forward Citations

Loading…