The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Aug. 20, 2012
Yuichi Sugiyama, Tokyo, JP;
Tatsuro Sawatari, Tokyo, JP;
Yusuke Inoue, Tokyo, JP;
Masashi Miyazaki, Tokyo, JP;
Yoshiki Hamada, Tokyo, JP;
Toshiyuki Kagawa, Tokyo, JP;
Yuichi Sugiyama, Tokyo, JP;
Tatsuro Sawatari, Tokyo, JP;
Yusuke Inoue, Tokyo, JP;
Masashi Miyazaki, Tokyo, JP;
Yoshiki Hamada, Tokyo, JP;
Toshiyuki Kagawa, Tokyo, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
Provided is a substrate with a built-in electronic component that can minimize an occurrence of a deformation such as warping or distortion of the substrate with a built-in electronic component, which is caused by a difference in rigidity between a region of low rigidity and a region of high rigidity that are formed in a core layer thereof. In the substrate with a built-in electronic component, electronic componentsare respectively housed in a plurality of housing portionsthat are formed in a core layer, and in the core layer, a plurality of openingsfilled with an insulatorare formed.