The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Apr. 26, 2007
Koji Morita, Chikusei, JP;
Shin Takanezawa, Chikusei, JP;
Kazunaga Sakai, Chikusei, JP;
Yuusuke Kondou, Chikusei, JP;
Koji Morita, Chikusei, JP;
Shin Takanezawa, Chikusei, JP;
Kazunaga Sakai, Chikusei, JP;
Yuusuke Kondou, Chikusei, JP;
HITACHI CHEMICAL CO., LTD., Tokyo, JP;
Abstract
Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.