The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Jun. 18, 2012
Tomoaki Toratani, Tokyo, JP;
Toshitaka Hara, Tokyo, JP;
Kyutaro Abe, Tokyo, JP;
Motomu Shibamura, Tokyo, JP;
Kyosuke Hashimoto, Tokyo, JP;
Tomoaki Toratani, Tokyo, JP;
Toshitaka Hara, Tokyo, JP;
Kyutaro Abe, Tokyo, JP;
Motomu Shibamura, Tokyo, JP;
Kyosuke Hashimoto, Tokyo, JP;
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
FURUKAWA AUTOMOTIVE SYSTEMS, INC, Shiga, JP;
Abstract
A substrate () includes conductive portions () formed by press working and a resin portion () integrally injection-molded with the conductive portions (). The conductive portions () are formed from, for example, a copper alloy. The resin portionis formed from, for example, PPS. A surface-mount component (), which is an electronic surface-mount component, is mounted on the substrate (). The surface-mount component () has electrodes () at its opposite sides, and the electrodes () and the respective conductive portions () are electrically connected by means of a solder (). The substrate () has a hole (), which functions as a stress relaxation mechanism, formed in the resin portion () (a portion extending therethrough) between connection portions () under the surface-mount component (). The substrate () also has resin-exposed portions (), which function as a stress relaxation mechanism, formed on opposite sides of the surface-mount component ().