The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Mar. 28, 2013
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Kumiko Hiehata, Kyoto, JP;

Takahiro Sumi, Kyoto, JP;

Jun Adachi, Kyoto, JP;

Jun Urakawa, Kyoto, JP;

Takayuki Tsukizawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 9/00 (2006.01); H02H 9/04 (2006.01); H01C 7/12 (2006.01); H01T 1/20 (2006.01); H01T 2/02 (2006.01); H01T 4/10 (2006.01);
U.S. Cl.
CPC ...
H02H 9/046 (2013.01); H01C 7/12 (2013.01); H01T 1/20 (2013.01); H01T 2/02 (2013.01); H01T 4/10 (2013.01);
Abstract

The ESD protection device includes: opposed electrodesincluding an opposed electrodeon one side and an opposed electrodeon the other side, and a discharge auxiliary electrode, the discharge auxiliary electrode being placed so as to extend from the opposed electrode on one side to the opposed electrode on the other side, wherein the discharge auxiliary electrode contains metal grains, semiconductor grains and a glass material, the metal grains, the semiconductor grains, and the metal grain and the semiconductor grain are bound together, respectively, via the glass material, the average grain size X of the metal grains is 1.0 μm or more, and the relationship between the thickness Y of the discharge auxiliary electrode and the average grain size X of the metal grains satisfies the requirement of 0.5≦Y/X≦3.


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