The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Jul. 03, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Hiroshi Iwano, Osaka, JP;

Mitsuru Iida, Mie, JP;

Daisuke Sato, Mie, JP;

Hidetoshi Takeyama, Mie, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/77 (2011.01); H01R 13/20 (2006.01); H01R 12/79 (2011.01);
U.S. Cl.
CPC ...
H01R 12/777 (2013.01); H01R 12/79 (2013.01); H01R 13/20 (2013.01);
Abstract

A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.


Find Patent Forward Citations

Loading…