The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

May. 18, 2012
Applicants:

Jordi Soler Castany, Mataró, ES;

Jaume Anguera Pros, Vinaros, ES;

Carles Puente Baliarda, Barcelona, ES;

Carmen Borja Borau, Barcelona, ES;

Inventors:

Jordi Soler Castany, Mataró, ES;

Jaume Anguera Pros, Vinaros, ES;

Carles Puente Baliarda, Barcelona, ES;

Carmen Borja Borau, Barcelona, ES;

Assignee:

Fractus, S.A., Barcelona, ES;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/36 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 9/26 (2006.01); H01Q 9/40 (2006.01); H01Q 9/42 (2006.01); H01Q 13/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/36 (2013.01); H01L 23/66 (2013.01); H01L 25/165 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48265 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/40 (2013.01); H01Q 9/26 (2013.01); H01Q 9/40 (2013.01); H01Q 9/42 (2013.01); H01Q 13/10 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73265 (2013.01);
Abstract

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna.


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