The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Apr. 27, 2010
Applicants:

Yiliang Wu, Oakville, CA;

Ping Liu, Mississauga, CA;

Anthony James Wigglesworth, Oakville, CA;

Nan-xing HU, Oakville, CA;

Inventors:

Yiliang Wu, Oakville, CA;

Ping Liu, Mississauga, CA;

Anthony James Wigglesworth, Oakville, CA;

Nan-Xing Hu, Oakville, CA;

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 51/05 (2006.01); H01L 21/268 (2006.01); H01L 51/00 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/052 (2013.01); H01L 21/268 (2013.01); H01L 51/0003 (2013.01); H01L 51/0036 (2013.01); H01L 51/0537 (2013.01); H01L 51/0545 (2013.01); C08K 5/0041 (2013.01); C08K 5/0091 (2013.01);
Abstract

An electronic device, such as a thin-film transistor, includes a substrate and a dielectric layer formed from a dielectric composition. The dielectric composition includes a dielectric material, a crosslinking agent, and an infrared absorbing agent. In particular embodiments, the dielectric material comprises a lower-k dielectric material and a higher-k dielectric polymer. When deposited, the lower-k dielectric material and the higher-k dielectric material form separate phases. The infrared absorbing agent allows the dielectric composition to attain a temperature that is significantly greater than the temperature attained by the substrate during curing. This difference in temperature allows the dielectric layer to be cured at relatively high temperatures and/or shorter time periods, permitting the selection of lower-cost substrate materials that would otherwise be deformed by the curing of the dielectric layer.


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