The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Nov. 03, 2010
Applicants:

Dennis Dean Clark, Lewistown, PA (US);

Barry C. Scheirer, McAlisterville, PA (US);

Ryan Manning, Lewistown, PA (US);

Inventors:

Dennis Dean Clark, Lewistown, PA (US);

Barry C. Scheirer, McAlisterville, PA (US);

Ryan Manning, Lewistown, PA (US);

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/04 (2006.01); H01L 41/047 (2006.01); A61N 7/02 (2006.01); B06B 1/06 (2006.01); G10K 11/32 (2006.01); A61B 18/00 (2006.01); A61N 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); A61B 2018/00011 (2013.01); A61N 7/02 (2013.01); A61N 2007/0065 (2013.01); A61N 2007/0078 (2013.01); A61N 2007/0095 (2013.01); B06B 1/0637 (2013.01); G10K 11/32 (2013.01);
Abstract

A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite convex and concave back surfaces, the front surface comprising an acoustic transmitting surface, and a plurality of electrodes located on the convex back surface for applying electrical transmit signals to the array, and a printed circuit board spaced apart from and in opposition to the back surface of the curved piezoelectric array which couples electrical signals to the electrodes of the array, the space between the printed circuit board and the curved piezoelectric array comprising an acoustic air backing passageway of the piezoelectric array for air-cooling the curved piezoelectric array and the printed circuit board.


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