The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Aug. 20, 2013
Applicant:
Cree, Inc., Durham, NC (US);
Inventors:
Thomas Yuan, Ventura, CA (US);
Bernd Keller, Santa Barbara, CA (US);
James Ibbetson, Santa Barbara, CA (US);
Eric Tarsa, Goleta, CA (US);
Gerald Negley, Chapel Hill, NC (US);
Assignee:
Cree, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/60 (2010.01); H05B 33/08 (2006.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 33/58 (2013.01); H05B 33/0821 (2013.01); H05B 33/0857 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01);
Abstract
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.