The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Feb. 24, 2012
Applicants:
Helmut Fischer, Lappersdorf, DE;
Andreas Plössl, Regensburg, DE;
Inventors:
Helmut Fischer, Lappersdorf, DE;
Andreas Plössl, Regensburg, DE;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/02 (2010.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 31/0687 (2012.01); H01L 31/02 (2006.01); H01L 33/64 (2010.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01L 33/02 (2013.01); H01L 31/1896 (2013.01); H01L 33/0079 (2013.01); H01L 33/641 (2013.01); H01S 5/0217 (2013.01); H01S 5/02476 (2013.01); H01L 31/06875 (2013.01); H01L 31/1892 (2013.01); H01S 5/02272 (2013.01); Y02E 10/544 (2013.01); H01L 31/02 (2013.01); H01L 31/18 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An optoelectronic semiconductor device includes an optoelectronic semiconductor layer sequence on a metal carrier element, which includes as a first component silver and as a second component a material having a lower coefficient of thermal expansion than silver, wherein the first and second components are intermixed in the metal carrier element.