The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Mar. 19, 2010
Applicant:
Ryuji Sugiura, Hamamatsu, JP;
Inventor:
Ryuji Sugiura, Hamamatsu, JP;
Assignee:
HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); H01L 21/78 (2006.01); B23K 26/00 (2014.01); B23K 26/40 (2014.01); B28D 1/22 (2006.01); B28D 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/0057 (2013.01); B23K 26/4075 (2013.01); B28D 1/221 (2013.01); B28D 5/0011 (2013.01); B23K 2201/40 (2013.01);
Abstract
An object to be processedis irradiated with laser light L along a line to cutwhile locating a converging point within the object, so as to form a modified region. Thereafter, the irradiation with the laser light L is performed again along the line, so as to form a modified regionbetween a front faceand the first modified regionin the objectand generate a fracture Cb extending from the modified regionto the front face. Therefore, a deflecting force Foccurring when forming the modified regionin the objectcan be released and canceled out by the fracture Cb. As a result, the objectcan be inhibited from deflecting.