The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Nov. 21, 2012
Applicant:

Arizona Board of Regents, a Body Corporate of the State of Arizona Acting for and on Behalf of Arizona State University, Scottsdale, AZ (US);

Inventors:

Douglas E Loy, Chandler, AZ (US);

David Morton, Columbia, MO (US);

Emmett Howard, Gilbert, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/66 (2006.01); H01L 21/683 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66765 (2013.01); H01L 21/6835 (2013.01); H01L 27/1266 (2013.01); H01L 29/78603 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H01L 29/78669 (2013.01); H01L 27/1218 (2013.01);
Abstract

Some embodiments can include a method of manufacturing first electronic device(s) and second electronic device(s), the method including: providing a carrier substrate having a first side and a second side, a first substrate bonded to the first side of the carrier substrate, and a second substrate bonded to the second side of the carrier substrate; depositing at least one layer of a first material over the first substrate while the first substrate is bonded to the first side of the carrier substrate to create a portion of the first electronic device(s); and depositing at least one layer of a second material over the second substrate while the second substrate is bonded to the second side of the carrier substrate to create a portion of the second electronic device(s). In many embodiments, the first substrate and/or the second substrate includes a flexible substrate. Other related systems and methods are also disclosed.


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