The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Sep. 23, 2014
Renesas Electronics Corporation, Kawasaki, JP;
Yoshiharu Kaneda, Kawasaki, JP;
Naoko Taniguchi, Kawasaki, JP;
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Abstract
A semiconductor device includes a die pad, which includes an upper surface and a lower surface, the upper surface forming a rectangular shape in plan view; a plurality of support pins that support the die pad; a plurality of inner leads arranged around the die pad; a plurality of outer leads connected to each of the inner leads; a semiconductor chip which includes a main surface and a back surface and in which a plurality of electrode pads is formed in the main surface; a plurality of wires which electrically couple the electrode pads of the semiconductor chip to the inner leads respectively; and a sealing body that seals the support pins, the inner leads, the semiconductor chip, and the wires. A first support pin of the plurality of support pins is integrally formed together with the die pad. The first support pin is terminated inside the sealing body.