The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Jan. 10, 2013
Panasonic Corporation, Kadoma-shi, Osaka, JP;
Toshiyuki Kojima, Kyoto, JP;
Tsukasa Shiraishi, Osaka, JP;
Norihito Tsukahara, Kyoto, JP;
Takayuki Hirose, Osaka, JP;
Keiko Ikuta, Osaka, JP;
Masayoshi Koyama, Osaka, JP;
Abstract
A semiconductor device () includes: a semiconductor chip () having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate () opposed to the first main surface; a first electrode () disposed between the first main surface and the heat dissipating plate () so as to be electrically connected to the semiconductor chip (); a pressure contact member () opposed to the second main surface; a second electrode () disposed between the second main surface and the pressure contact member () so as to be electrically connected to the semiconductor chip (); and a pressure generating mechanism that generates a pressure for pressing the first electrode () into contact with the heat dissipating plate () and the semiconductor chip () and pressing the second electrode () into contact with the pressure contact member () and the semiconductor chip ().