The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Jan. 03, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jun-Won Han, Seoul, KR;

Jae-Hyun Kim, Yongin-si, KR;

Tae-Hoon Kim, Anyang-si, KR;

Ho-Geun Lee, Namyangju-si, KR;

You-Jeong Jeong, Seoul, KR;

Jung-Sik Choi, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 23/00 (2006.01); B32B 7/06 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); B32B 7/06 (2013.01); Y10T 428/1476 (2015.01); Y10T 428/2839 (2015.01); H01L 21/6835 (2013.01);
Abstract

A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.


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