The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Dec. 29, 2011
Applicants:

Nadir Sharaf, Bloomfield Township, MI (US);

Slobodan Pavlovic, Novi, MI (US);

Dilip Daftuar, West Bloomfield, MI (US);

Ajmal Ansari, Canton, MI (US);

Inventors:

Nadir Sharaf, Bloomfield Township, MI (US);

Slobodan Pavlovic, Novi, MI (US);

Dilip Daftuar, West Bloomfield, MI (US);

Ajmal Ansari, Canton, MI (US);

Assignee:

Lear Corporation, Southfield, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 2/08 (2006.01); H05K 7/20 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01G 2/08 (2013.01); H02M 7/003 (2013.01); H05K 7/209 (2013.01); Y02T 10/7022 (2013.01);
Abstract

A heat conductor for use with an inverter in an electric or hybrid-electric vehicle, the inverter including a direct current link capacitor having multiple film capacitors configured in a stack to form a substantially polygonal prism. Each film capacitor has orthotropic characteristics. The heat conductor has a first substantially planar member configured to contact a first side of the polygonal prism formed by one of the film capacitors, and a second substantially planar member configured to contact a second side of the polygonal prism opposite the first side of the rectangular prism, the second side of the rectangular prism formed by another one of the film capacitors. The first and second planar member are thermally conductive for dissipating heat generated by the film capacitors, are attached by an interconnect, and have sufficient rigidity to confine expansion of the film capacitors across the thicknesses thereof.


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