The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Jun. 03, 2011
Applicants:

Chieh-yuan Cheng, Hsinchu, TW;

Hung-yeh Lin, Yilan County, TW;

Inventors:

Chieh-Yuan Cheng, Hsinchu, TW;

Hung-Yeh Lin, Yilan County, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G03B 17/12 (2006.01); G02B 7/02 (2006.01); G02B 7/00 (2006.01);
U.S. Cl.
CPC ...
G02B 7/02 (2013.01); G03B 17/12 (2013.01); G02B 7/003 (2013.01); G02B 7/021 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01);
Abstract

A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.


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