The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Apr. 20, 2010
Takayuki Hirao, Settsu, JP;
Kenji Ichikawa, Settsu, JP;
Shigehito Sagisaka, Settsu, JP;
Yumi Nakano, Settsu, JP;
Takayuki Hirao, Settsu, JP;
Kenji Ichikawa, Settsu, JP;
Shigehito Sagisaka, Settsu, JP;
Yumi Nakano, Settsu, JP;
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Abstract
The present invention provides an ethylene/tetrafluoroethylene copolymer showing good heat resistance and good crack resistance even in a high temperature environment. The present invention is an ethylene/tetrafluoroethylene copolymer, comprising: copolymerization units derived from ethylene; tetrafluoroethylene; and a fluorine-containing vinyl monomer represented by general formula: CH═CH—Rf in the formula, Rf representing a perfluoroalkyl group containing four or more carbon atoms, a fluorine-containing vinyl monomer content being 0.8 to 2.5 mol % to a total amount of all monomers, an ethylene/tetrafluoroethylene molar ratio being 33.0/67.0 to 44.0/56.0, a CH index being 1.40 or less, a melting point being 230° C. or higher, and a melt flow rate being 40 (g/10 minutes) or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile