The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Sep. 27, 2011
Applicants:

Scott Robert Huelskamp, Dayton, OH (US);

Joel James Everhart, Xenia, OH (US);

David E. Havens, Bellbrook, OH (US);

Steven Fillmore Hanson, Derby, KS (US);

Jeffrey W. Priest, Rose Hill, KS (US);

Carl Ray Fiegenbaum, Rose Hill, KS (US);

Thomas Joseph Barnell, Dayton, OH (US);

Inventors:

Scott Robert Huelskamp, Dayton, OH (US);

Joel James Everhart, Xenia, OH (US);

David E. Havens, Bellbrook, OH (US);

Steven Fillmore Hanson, Derby, KS (US);

Jeffrey W. Priest, Rose Hill, KS (US);

Carl Ray Fiegenbaum, Rose Hill, KS (US);

Thomas Joseph Barnell, Dayton, OH (US);

Assignee:

Spirit AeroSystems, Inc., Wichita, KS (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/28 (2006.01); B29C 33/48 (2006.01); B29C 33/04 (2006.01);
U.S. Cl.
CPC ...
B29C 33/485 (2013.01); B29C 33/046 (2013.01);
Abstract

A method and support apparatus for providing structural support to a mold or mandrel, such as a shape memory polymer (SMP) apparatus configured for shaping a composite part. The support apparatus may comprise a rigid structural member and a plurality of SMP cells attached thereto and configured to inflate or deploy in a malleable state toward and against a surface of the SMP apparatus, mold, or mandrel. Then the SMP cells may be returned to a rigid state while still pressed against this surface, thereby providing structural support when composite material is applied to an opposite surface of the SMP apparatus, mold, or mandrel. After the composite material is cured into the finished composite part, the SMP cells may be deflated or otherwise collapse toward the structural member to provide enough clearance to be removed from the cured composite part.


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