The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Jul. 16, 2010
Applicants:

Jaap Roger Haartsen, Eindhoven, NL;

Ronald Dekker, Eindhoven, NL;

Pascal DE Graaf, Eindhoven, NL;

Nicolaas Johannes Anthonius Van Veen, Eindhoven, NL;

Alphonsus Tarcisius Jozef Maria Schipper, Eindhoven, NL;

Inventors:

Jaap Roger Haartsen, Eindhoven, NL;

Ronald Dekker, Eindhoven, NL;

Pascal De Graaf, Eindhoven, NL;

Nicolaas Johannes Anthonius Van Veen, Eindhoven, NL;

Alphonsus Tarcisius Jozef Maria Schipper, Eindhoven, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/68 (2006.01); A61B 5/11 (2006.01); A61B 5/00 (2006.01); A61M 15/00 (2006.01); G01P 5/10 (2006.01); G01P 5/12 (2006.01); G01P 13/00 (2006.01); G08B 21/04 (2006.01); A61M 5/168 (2006.01); A61M 16/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/1117 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49117 (2015.01); A61B 5/681 (2013.01); A61B 5/6831 (2013.01); A61B 2562/0219 (2013.01); A61B 2562/0271 (2013.01); A61M 5/16886 (2013.01); A61M 15/00 (2013.01); A61M 2016/0021 (2013.01); A61M 2205/332 (2013.01); A61M 2205/3334 (2013.01); A61M 2205/3368 (2013.01); A61M 2205/3375 (2013.01); G01P 5/10 (2013.01); G01P 5/12 (2013.01); G01P 13/006 (2013.01); G08B 21/0446 (2013.01);
Abstract

A thermal flow sensor integrated circuit for sensing flow in a channel based on temperature measurements, the integrated circuit having a temperature sensing element () on a front side of the integrated circuit arranged to face the channel, and a bond pad () coupled electrically to the temperature sensing element, for making electrical contact off the integrated circuit, the bond pad being arranged to face away from the channel. By having the bond pad facing away from the channel, the space needed for the bond pad and any connections to it need not extend beyond the temperature sensing element and get in the way of the channel. Hence the temperature sensing element can be located closer to the channel or in the channel to enable measurements with better response time and sensitivity.


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