The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Jul. 15, 2010
Ryo Kuwabara, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Masahiro Ono, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Ryo Kuwabara, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Masahiro Ono, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Abstract
An electronic moduleincludes: a circuit boardhaving a first surface and a second surface opposite the first surface; and a plurality of electronic componentsmounted thereon. The electronic componentsare sealed at the first surface of the circuit board, with a mold bodycomposed of a resin composition. A shield layeris formed on the surface of the mold body. The glass transition temperature of a resin included in the mold bodyis higher than the glass transition temperatures of resins included in the circuit boardand the shield layer, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.